| |
|
Surface Mount and Related Technologies (Electrical and Computer Engineering)
G. Ginsberg
CRC, 1989
|
|
|
|
|
|
| |
|
Continuing Education in Surface-Mount Technology -- Increasing your knowledge base could mean the difference ...
Phil Zarrow
UP Media Group, Inc., 2001
This digital document is an article from Circuits Assembly, published by UP Media Group, Inc. on August 1, 2001. The length of the article is 950 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser. Citation Details Title: Continuing Education in Surface-Mount ...
|
|
|
|
|
|
| |
|
Surface Mount Technology for Concurrent Engineering and Manufacturing (Electronic Packaging and ...
Frank Classon
McGraw-Hill Companies, 1993
|
|
|
|
|
|
| |
|
FUNDAMENTALS OF SURFACE MOUNT TECHNOLOGY EB-3135
FORREST M. MIMS III
HEATH COMPANY, 1989
|
|
|
|
|
|
| |
|
IEC 60068-2-69 Ed. 1.0 b:1995, Environmental testing - Part 2: Tests - Test Te: Solderability testing of ...
IEC TC/SC 91
Multiple. Distributed through American National Standards Institute (ANSI), 2007
Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices. The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.
|
|
|
|
|
|
| |
|
Surface Mount Solder Joint Evaluation Desk reference Manual DRM-SMT
The Institute for Interconnecting and Packaging Electronic Circuits
IPC, 1998
Provides visual examples of solder joints for three of the most popular component types: rectangular chip, J-lead and gull wing.
|
|
|
|
|
|
| |
|
Applied Surface Mount Assembly: A guide to surface mount materials and processes (Electrical Engineering)
Robert J. Rowland, Paul Belangia
Springer, 1993
Here is the first how-to handbook to cover the nuts and bolts of starting and running a successful SMT operation. This manual shows step by step how to set up and operate ny SMT procedure. It explains how to evaluate and refine SMT processes and keep them under control on a daily basis.
|
|
|
|
|
|
| |
|
Surface Mount Technology for PC Boards 1 review
James Hollomon, Glenn Blackwell
Delmar Cengage Learning, 2005
very good book for a SMT manager
very good book for a SMT manager
|
|
|
|
|
|
| |
|
Design and characterization of a vision-assisted system for surface-mount component placement.: An article ...
S. Hossein Cheraghi, E. Amine Lehtihet, ...
Institute of Industrial Engineers, Inc. (IIE), 1996
This digital document is an article from IIE Transactions, published by Institute of Industrial Engineers, Inc. (IIE) on October 1, 1996. The length of the article is 6746 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser. From the author: The accurate placement of ...
|
|
|
|
|
|
| |
|
Surface Mount Technology,: Materials, Processes and Equipment1 review
Carmen Capillo
Mcgraw-Hill (Tx), 1989
excellent
excellent book. details, in depth knowledge of a very experienced manufacturing engineer is transfered to the reader from this book.
|
|
|
|
|
|
| |
|
IEC 61192-2 Ed. 1.0 b:2003, Workmanship requirements for soldered electronic assemblies - Part 2: ...
IEC TC/SC 91
Multiple. Distributed through American National Standards Institute (ANSI), 2007
Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.
|
|
|
|
|
|
| |
|
IEC 60384-19 Ed. 2.0 en:2006, Fixed capacitors for use in electronic equipment - Part 19: Sectional ...
IEC TC/SC 40
Multiple. Distributed through American National Standards Institute (ANSI), 2007
is applicable to fixed surface mount capacitors for direct current, with metallized electrodes and polyethylene-terephthalate dielectric for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted direct onto substrates for hybrid circuits or onto printed boards. These capacitors may have "self-healing properties" depending on conditions of use. They are primarily intended ...
|
|
|
|
|
|
| |
|
IEC 60539-2 Ed. 1.0 en:2003, Directly heated negative temperature coefficient thermistors - Part 2: Sectional ...
IEC TC/SC 40
Multiple. Distributed through American National Standards Institute (ANSI), 2007
is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards.
|
|
|
|
|
|
| |
|
Scientific Guide to Surface Mount Technology 1 review
Colin Lea
Electrochemical Publications Ltd, 1988
great book
I had to order the book directly from the publisher in England but it was a very helpful and useful text. Very precise and well written I wouldn't be at all surprised if this became the definitive bible for surface mount technologies for the new millenium.
|
|
|
|
|
|
| |
|
Statistical Process Control for Surface Mount Technology
Dr. William S. Messina
Data Sleuths, 1999
This book is the outgrowth of 5 years consulting experience in the applications of statistical methods to Surface Mount Technology (SMT). This book provides the reader with the methodology of applying Statistical Process Control (SPC) on the manufacturing line. This methodology is called data sleuthing. The book is divided into two parts. Part I provides an overview of the methods of data sleuthing. Part II provides a case study approach ...
|
|
|
|
|
|