The 16 chapters in this book cover a wide spectrum of flip chip technologies. Following the introductions in Chapters 1 and 2, it is a pleasure to find a full chapter focused on lead-free solders. This is an emerging area in electronic packaging and should deserve special attention. Chapter 4 is another important subject in this book. Without high-density PCBs and substrates, the applications of flip chips would become very difficult. Chapter 5 introduces flip chips with conductive adhesives. This is mainly for chip-on-glass (COG) applications. The next three chapters provide abundant information regarding underfill encapsulation. In particular, the analyses and discussion for imperfect underfills are rather unique. After a brief chapter on the thermal management of flip chip on board, a comprehensive coverage on wafer-level packaging is provided. This is another highlight in this book. Several wafer-level chip scale packages (WLCSP) are introduced and the technlogy of wafer-level metallization and redistribution is discussed in depth. Chapters 11 and 12 concern two special topics: via-in-pad (VIP) and Direct Rambus (RIMM), respectively. The provided information is rather new. The next three chapters are focused on three forms of plastic ball grid array (PBGA) packages. Although two of them use wire bonding as the chip-level interconnect, they serve as good references for the comparison with solder-bumped flip chip PBGA packages. The last chapter of this book gives plenty of experimental results from failure analysis. This information is very helpful for understanding the failure mechanism of flip chip assemblies.
In summary, the present monograph is a very good reference book on low-cost flip chip technologies. The information is unique and up-to-date. I enjoy this book a lot and find it very helpful to my research work. It is a great value to the packaging engineers and researchers!
On the other hand, it is also a very suitable reference book for a packaging class in the graduate school level. For students with material or chemistry/chemical engineering background, they can very much understand two-thirds of the contents. As to students with mechanical or electrical engineering background, with instructor's guidance, they can also grasp this part of knowledge with reasonable effort. For the rest one-third of contents that involves the use of the theory of fracture mechanics and finite element methods, most students should also be able to understand the spirit without much difficulty through the instructor's explanation.
Enboa Wu, Director for Electronic Packaging Technology Division, ERSO/ITRI, Taiwan; and Professor of Institute of Applied Mechanics, National Taiwan University.
As someone who was in the industry, and currently working at the University of Oxford - I can say that the book works great for both. Altogether, an excellent and timely book for electronic packaging people!
This book covers all the important subjects (many of those I am not aware of) on low-cost flip chip Technologies. Also, for each subject, useful data, technical know-how, and engineering analyses are presented.
I strongly recommend it to everyone who is working in electronic packaging and interconnetions. I am sure you will find it useful!Low Cost Flip Chip Technologies As the electronics industry is being driven by market demand to produce multi-functional, high-performance, miniature, and light-weight products, flip chip technology has been identified a key enabler, as well as a core technology for future electronics products. Although there have been numerous studies on this subject, they are scattered in different sources of literature and thus make it difficult for any one who would like to obtain a general, systematic, and comprehensive understanding of this technology.
This book comes just in time to fulfill the need and, in my opinion, is a best-in-class in the area of flip chip technologies for organic boards. Its 16 chapters cover a full spectrum from theory to application and provide scientists and engineers with an excellent, most up-to-date reference in flip chip technologies.
The book discusses major applications of flip chip technologies in direct chip attachment, wafer level CSP and plastic BGA, together with numerous examples of packages either being widely used in industries or emerging as a trend in the future. Each technology is discussed in detail from various aspects, such as design, PCB requirements, manufacturing, material, thermal management, failure analysis, and reliability, along with comprehensive references of literature. In fact, most of them represent previous work done by the author, who is not only a leading expert in electronic packaging industry but an active author of more than 10 books in the area of electronic packaging.
I found this book extremely useful to my research in electronic packaging technologies and thus highly recommend to whomever might need to understand and apply this technology to their work or studies.
Yi-Hsin Pao, Ph.D. Manager, Materials Engineering Dept. Visteon Automotive Systems Ford Motor Company
*IC trends and packaging technology updates*Over 12 different wafer-bumping methods...more than 100 lead-free solder alloys*Sequential build up PCB with microvias and via-in-pad*How to select underfill materials*And much, much more!